Samsung Electronics has announced a new family of chip-scale package (CSP) LEDs that the company refers to as Fillet-Enhanced CSP (FEC) LEDs. CSP LEDs are inherently five-sided emitters with no package covering the sides of the devices. The FEC products use a reflective coating on the four sides of the CSP device to reflect light and maximize the flux out of the top surface.
Interested in articles & announcements on packaged and CSP LEDs?
We have covered the five-sided emission issue in several articles since CSP LEDs first came to market via Lumileds at Strategies in Light 2013. And we also covered the topic of emission and beam in a recent webcast on packaged LEDs.
In many applications, five-sided emission is perfectly fine. For example, linear luminaires need wide beams and light in every direction. And other applications, such as the street lights we covered at LightFair International (LFI) this year, place the LED under a total internal reflection (TIR) lens, eliminating any issues with the side emission.
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